Microsemi announces SmartFusion2 FPGA SoCs
Microsemi has announced the next-generation of their FPGA SoCs, the SmartFusion2 family, which combine a flash-based FPGA fabric with a 166 MHz ARM Cortex-M3 processor on a single chip. The SmartFusion2 will be available in configurations from 5K 4-input Look-Up Tables (LUT) to 120K LUT.
The Microprocessor Sub-System (MSS) in the SmartFusion2 consists of a 166 MHz ARM Cortex-M3 processor, with 64KB of on-chip embedded SRAM (eSRAM) and 128KB/256KB or 512KB of embedded Non-Volatile Memory (eNVM), and a 8 Kbyte instruction cache.
Esam Elashmawi, Vice President and General Manager of the SoC Product Group at Microsemi, says that the new SmartFusion2 adds “mainstream” features that were lacking previously, such as embedded memory and multiply-accumulate blocks to provide for DSP functions. High bandwidth interfaces in the SmartFusion2 include PCI Express (PCIe) with 16x 5G SERDES, and double data rate DDR2/DDR3 memory controllers. Peripheral support includes Controller Area Network (CAN) bus, Gigabit Ethernet and USB 2.0.
Microsemi emphasizes the advanced design and data security capabilities of SmartFusion2, with secure key storage capability using a Physically Unclonable Function (PUF) key enrollment and regeneration capability. SmartFusion2 is protected from Differential Power Analysis (DPA) attacks using technology from the Cryptographic Research Incorporated (CRI) portfolio. Optional cryptographic security accelerators are available, including the Advanced Encryption Standard AES-256, Secure Hash Algorithm SHA-256, 384 bit Elliptical Curve Cryptographic (ECC) engine and a Non-Deterministic Random Bit Generator (NRBG).
SmartFusion2 provides a “Flash*Freeze” standby power mode that retains the state of all registers SRAMs and I/O, and can be entered or exited in ~100 micro seconds for low duty cycle applications where short bursts of activity are required. Microsemi specifies power dissipation at 1 mW in Flash*Freeze mode, and 10 mW of static power during operation.
Microsemi is providing customers with SmartFusion2 M2S050T (48,672 LUT) engineering samples now, and is targeting first production silicon slated for early 2013.