News - Conferences and Awards
-
ARM Training Give-Aways At Device Developers' Conference
Feabhas to offer free ARM Accredited Engineer exam voucher and a copy of "Professional Embedded ARM Development" at UK Device Developers Conference.
-
Imagination Technologies Shares Program for Imagination Summit 2014: 'Inspiring Tomorrow's Connected World'
Summit to be Held May 22nd in Silicon Valley
-
Cambridge Conference to Address Software Reliability
UK Conference to discuss coding standards and development tools for the development of software for safety critical and highly reliable systems.
-
The 3rd IEEE/TRB International Conference on Connected Vehicles and Expo (ICCVE 2014)
Connected Vehicles is an emerging technical field which crosses multiple disciplines and industries including automotive, travel & transportation, information technology, communications, consumer electronics, industrial electronics, media & entertainment, energy & utilities, insurance, etc. By connecting vehicles with various devices, services and participants, we are able to make our mobility more enjoyable, sustainable and safe.
-
UK Hi-Tech Engineering Conference Set for Success
UK conference explores new tools and technologies for the development of intelligent systems and devices
-
Te Connectivity Recognizes Top Performing Distributors With Awards For Outstanding Achievements In 2013
Avnet Electronics Marketing and Mouser Electronics, Inc. honored with TE's 2013 Global Distributor of the Year Awards
-
ClioSoft's Ranjit Adhikary to Speak on Design Reuse and IP Management at EDPS
ClioSoft will participate in IP track, speaking on the need to move away from the traditional definiton and usage of IP
-
Blazent Showcases Next-Generation IT Data Accuracy Solutions at Upcoming ServiceNow Knowledge14 Conference
t knowledge14, Blazent will showcase its new automated IT Data Accuracy Solution for ServiceNow that solves the garbage-data-in, garbage-data-out problem for Service Management using advanced data science techniques to ensure the CMDB has current, complete and correct IT data.
-
Electronics Enclosure Experts to Exhibit at UK Technology Conference
Cove Industries will be exhibiting at the UK Device Developers' Conference
-
The 3rd International Conference on Connected Vehicles and Expo (ICCVE 2014)
November 3-7, 2014, Vienna, Austria - "The future of mobility enabled by Connected Automated Vehicles"
-
MIPI(r) UniPort-M Selected by Google for Modular Smartphone 'Project Ara'
Jürgen Urban, MIPI UniProSM Working Group Chair, to Present on behalf of MIPI Alliance
-
Oski Technology to Host Latest Decoding Formal Club for Formal Verification Enthusiasts
April 21 Agenda Includes Panel on Building Formal Team, Presentation on Formal Test Planning
-
Feabhas to Present at UK Reliable Software Developers' Conference
Feabhas to help present a half-day workshop introducing the MISRA C:2012 software coding standard for reliable and safety critical systems
-
Intersec wins the Big Data Paris Innovation Award
The 3rd edition of the Big Data Paris summit rewarded Intersec's oustanding innovation in the Weve1 project
-
Top Image Systems and Feith Present Procure-to-Pay Automation for Oracle Users at COLLABORATE14
Produced by three independent Oracle users groups, COLLABORATE14 will deliver the full spectrum of Oracle Applications and Technology education via some 1250 sessions to an expected audience of some 6000 IT professionals.
-
3D Systems Brings 3DPRINTING 2.0 to the Additive Manufacturing User Group
MUG attendees will have the opportunity to experience 3DPRINTING 2.0--defined by exponential 3D printing speed, size and capacity along with advanced performance materials and scan-to-design and inspection tools --and what it means to the industrial user.
-
The DATE 2014 conference and exhibition in Dresden attracted more than 1450 experts
The DATE 2014 Conference and Exhibition ended on Friday, March 28, 2014, attracting more than 1450 participants from all over the world and closing with a throughout positive feedback from both visitors and exhibitors.
-
Kilopass to Participate at GSA Silicon Summit, TSMC 2014 Technology Symposia, ChipEx 2014
Will Offer Views on Advances in Memory Performance and Demonstrations of NVM IP for TSMC 20nm Process
-
3D Systems Brings 3DPRINTING 2.0 to Inside 3D Printing NYC Conference
Showcases most advanced manufacturing 3D printers and materials; Features full-color, multi-materials, metal, ceramic and edible 3D printing
-
Toradex announces inaugural winners of Embedded Design Challenge
Toradex announced the inaugural winners of its Global Embedded Design
Feabhas