EnSilica launches the eSi-ZM1 System-on-Module for faster, lower risk and smarter embedded systems development

First of new eSi-Module range targets high production volume embedded systems

Block diagram of EnSilica\'s new eSi-ZM1 System-on-Module
Block diagram of EnSilica\'s new eSi-ZM1 System-on-Module

Wokingham, UK – 29th May 2013. EnSilica, a leading independent provider of IC design services and system solutions, has launched the eSi-ZM1, a small form factor System-on-Module designed to facilitate faster, lower risk development of smarter embedded systems that demand real-time hardware performance, all without sacrificing differentiation, integration or flexibility.

The eSi-ZM1 is EnSilica’s first product in a new range of eSi-Modules and is built around the Xilinx Zynq Extensible Programming Platform. Combining a powerful dual core ARM Cortex A9 MPcore subsystem running embedded Linux together with the Xilinx Series-7 FPGA fabric, it is ideal for developing a range of commercial and industrial applications for automotive electronics, consumer electronics, industrial automation, broadcast, medical imaging and wired communications. However, the small form factor, low-cost, high pin count, robust connector, together with availability in commercial and industrial temperature grades, makes it ideal for both volume production and prototyping of a wide range of Xilinx Zynq-based products. The eSi-ZM1 measures just 82mm by 50mm and is currently being successfully deployed in a number of production products including a radar and media server.

“By encompassing the challenging part of an embedded system into a small module, we have dramatically simplified baseboard development both in terms of number of layers and layout complexity,” said Ian Lankshear, CEO of EnSilica. “The eSi-ZM1 module is flexible enough to be used across a range of applications and hardware designs with simple integration effort, reducing the overall hardware development effort and re-spin risk for customers.”

The eSi-ZM1 is unique in providing an exceptionally high I/O count through an MXM3.0 connector, delivering the full capability of the FPGA fabric without sacrificing signal integrity. It provides excellent connectivity through a broad range of advanced I/O including a Gigabit Ethernet PHY with 1588 time stamping, a 4-port USB 2.0 hub, I2C and micro SD-card holder. Additionally, the programmable logic provides unlimited possibilities to add virtually any peripheral or create custom accelerators to extend system performance to suit the target application.

EnSilica provides full firmware and software support for the eSi-ZM1, including a compatible BSP and embedded Linux build pre-loaded on SD-card. Although the module is ready to use out-of-the-box, EnSilica provides a range of complementary custom design and development services both for eSi-ZM1 integration and wider product development.

EnSilica’s eSi-Module product roadmap also includes a System-on-Module based on the Altera Cyclone IV SoC.

About EnSilica

EnSilica is an established company with many years experience providing high quality IC design services to customers undertaking FPGA and ASIC designs. EnSilica has an impressive record of success working across many market segments with particular expertise in multimedia and communications applications. Customers range from start-ups to blue-chip companies. EnSilica can provide the full range of IC design services, from System Level Design, RTL coding and verification through to either a FPGA device or the physical design for ASIC designs. EnSilica also offers a portfolio of IP, including a highly configurable 16/32 bit embedded processor called eSi-RISC, the eSi-Comms range of communications IP, eSi-Connect range of processor peripherals and eSi-Crypto encryption IP. For further information about EnSilica, visit www.ensilica.com.