News
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Microsemi is First FPGA Provider to Offer Open Architecture RISC-V IP Core and Comprehensive Software Solution for Embedded Designs
Company's IGLOO2, SmartFusion2 and RTG4 Devices are the Ideal FPGAs to Build RISC-V CPU Subsystems, Offering Lower Power and Proven Security
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Curtiss-Wright's New Memory-Maximized 16-Core Intel(r) Xeon(r) Processor D-based DSP Module is First to Support Up to 128 GB DDR-4 Memory
New Variant of Popular Supercomputer-class CHAMP-XD2 OpenVPX(tm) module eliminates data bottlenecks for compute-intensive, memory-bound ISR applications
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Schroff Novastar configurator
Using easy drag and drop operation to obtain a graphic model
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4DSP Announces a High I/O Density, SWAP Optimized Compact Embedded System for Accelerating Development
The CES821 can serve as a customizable standalone lab platfrom or a deployed embedded solution for applications such as digital beamforming, MIMO software defined radio, multi-channel RADAR, direction finding and more.
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Alta Devices To Discuss How Next Generation Drones And Automobiles Can Demonstrate That Solar Technology Isn't Just For Rooftops
Alta Devices shows that Solar Technology Works for Drones and Cars. It provides uniquely high amounts of power from the sun.
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RFEL awarded a further phase of the Osborne programme for Defence Science and Technology Laboratory, Porton Down
RFEL has been awarded a further phase of the Osborne programme for Defence Science and Technology Laboratory (DSTL), Porton Down, UK. The Osborne programme provides DSTL with the capability to conduct Electronic Warfare (EW) Systems development using Model-Based Design.
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Curtiss-Wright Doubles the Speed of Rugged sFPDP High Speed Data Link Cards to 5 Gb/s
Quad channel PCIe and XMC FibreXtreme modules now support sustained data rates up to 494 MB/s per channel
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MYIR Introduced the High-performance Xilinx Zynq-7015 SoM and DevKit
MYIR Introduced Linux-ready CPU Module and development board based on Xilinx Zynq-7015 SoC with dual-core ARM Cortex-A9 processor and Artix-7 FPGA.
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TEWS TECHNOLOGIES Introduces 16 Channel Thermocouple/RTD/Strain-Measurement XMC
The TXMC590 is a standard Switched Mezzanine Card (XMC) compatible module offering 16 channels capable of measuring thermocouples, resistive sensors like RTD and thermistors, and strain gauges. Released as an extension to TEWS' growing portfolio of XMC modules, the TXMC590 is designed for industrial control, telecommunication infrastructure, medical equipment, traffic control and COTS applications.
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VIM554 Audio/Video Capture Module
Fastwel is proud to announce an extension to the range of its 3U CPCI S.0 peripherals VIM554 audio/video capture module, which designed to be used in railway, marine and other mission critical applications. The module is made for receipt of the Standard Definition Analog Video (SDTV) and voice signals, their transformation into the digital form and input to computer system memory.
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Skyworks' MIPI(r) Antenna Aperture Tuners
New Product Announcement: SKY19247-686LF and SKY19237-001
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XJTAG Delivers Fast ISP Flash Configuration for ARM-Based FPGA SoCs
XJTAG announces up to 20 times faster In-System Programming capability for Flash memories connected to dual ARM-Cortex-A9 based FPGAs.
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Embedded image processing applications for search and rescue UAVs targeted by EU TULIPP project
EU TULIPP (Towards Ubiquitous Low-power Image Processing Platforms) project is a new initiative targeting the development of high performance, energy-efficient embedded systems for the growing range of increasingly complex image processing applications.
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EU's new TULIPP project targets high-performance, energy-efficient embedded systems for complex image processing applications
TULIPP (Towards Ubiquitous Low-power Image Processing Platforms) is a new EU initiative targeting the development of high performance, energy-efficient embedded systems for the growing range of increasingly complex image processing applications.
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Vicor Introduces New 60V Cool-Power ZVS Buck-Boost Regulators
New regulators feature zero voltage switching technology
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Annapolis Micro Systems Introduces Two New High-Performance Mezzanine Cards for Signal Processing
DRFM-Optimized 5.0GSps Card Delivers Scorching 15ns Latency
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ADLINK Technology Showcasing Latest PXI Express Test Systems and Application-specific Platforms at IEEE's 2016 AUTOTESTCON
Demonstrated applications will include power supply testing and microphone array measurement
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MIPI Alliance Releases MIPI Gigabit Debug For IP Sockets
Part of the MIPI Gigabit Debug family, MIPI GbD for IPS offers convenience and versatility, enabling companies to debug devices during development and again after products are commercialized and connected to networks. The specification can be used to debug all types of connected devices, from smartphones to end points on the Internet of Things (IoT).
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Aldec Delivers Verification Support for Embedded Applications with New TySOM Embedded Development Kit
Henderson, NV - August 17, 2016 - Aldec, Inc., a pioneer in mixed-HDL language simulation and hardware-assisted verification solutions for FPGAs and ASICs, today announced the release of TySOM(tm) Embedded Development Kit (EDK). The TySOM EDK targets embedded designers who require a platform with higher-performance RTL simulation and debugging for developing leading-edge embedded applications for IoT, Computer Vision, Automotive, Robotics and Factory Automation.
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Gigabyte and Cavium announce 14 ARM-based server products
Collaboration brings the world's most powerful 64-bit ARM(r) based servers to market to address increasingly demanding application and workload requirements
Barbara Quinlan
Curtiss-Wright Defense Solutions
Pentair
Alta Devices
MYIR
Fastwel.com
Tami Stegmaier
TULIPP
TULIPP
Caviuminc