White Papers
-
Deep dive into High Sigma Monte Carlo analysis. Different methods and their advantages/disadvantages. Introduction to ProPlus' high sigma technology licensed from IBM. Si-validated and production use for 6+ years. Supports >7 sigma which is key for advanced nodes like FinFET. Supports >10K variables which is required for SRAM arrays and I/O circuits.
-
Shock and Vibration Testing of the SA.45s Chip Scale Atomic Clock (CSAC) Validation Build Units
The Symmetricom(r) SA.45s Chip Scale Atomic Clock (CSAC) is designed for field applications where atomic clocks typically have not been deployed before.
-
Selecting the Right Embedded SSD Storage Solution
For embedded systems designers, selecting the optimal solid state drive (SSD) form factor has never been more difficult. That is because the industry joke, "standards are great -- everybody ought to have one", unfortunately rings true especially when referring to SSDs.
-
Using the High Performance Memory Subsystems in an FPGA for Innovative Bridging Applications
Microsemi IGLOO2 FPGAs offer a superior solution to common "Bridge" applications that connect popular networking, communications and peripheral ports on a single device. The dedicated High-Performance Memory Subsystem combines large amounts of on-chip memory, intelligent DMA controllers, efficient controllers for off-chip DDR memory, an SPI port and security features to easily implement a variety of bridging "glue logic" functions.
-
The 4th generation Intel(r) Core(tm) processors
One new microarchitecture for all mid-range to high-end embedded applications
-
Tackling Thermal Design Challenges of Smaller, Lighter and More Efficient Avionics
This article demonstrates how thermal transient testing combined with computational fluid dynamics (CFD) can help find this balance and ensure that safety critical devices work within their prescribed temperature limits.
-
PowerProtector: Superior Data Protection for NAND Flash
The unstable power conditions of outdoor applications such as transportation, telecommunications/networking and embedded systems run the risk of data loss and drive corruption during a sudden power failure. Power failures result in downtime as embedded systems need to be reformatted and operating systems reinstalled. Furthermore, the overall productivity decreases as the cost of ownership increases for industrial grade memory solutions, which are specifically designed for high performance mission critical applications.
-
High-end graphics performance for low-power small-form-factor (SFF) designs
Boards and modules with AMD's Embedded G-Series platform for graphics-intensive SFF applications make migration easy.
-
High-Speed Switched Serial Fabrics Improve System Design
As evolutionary enhancements to the venerable VMEbus, both VXS and VPX deliver significant improvements in data bandwidth, connectivity power distribution, and cooling.
-
Deep Packet Inspection (DPI) - Use Cases, Requirements and Architectures
Deep packet inspection (DPI) is a technique with many different use cases, delivering information about packet flows and content as well as allowing network operators and service providers to ensure quality of service at an application level. As more and more use cases are being implemented in the market, a common set of requirements has developed. These requirements have driven a set of architectures that deliver the level of performance, throughput and statistical data collection required to fulfill the respective task at hand. This white paper will analyze use cases, define a set of common requirements for DPI applications and outline several architectures and building blocks that simplify the creation of scalable, reliable DPI appliances.
-
Putting FPGAs to Work in Software Radio Systems -- Seventh Edition
FPGAs have become an increasingly important resource for software radio systems.
-
High Performance Embedded Computing and Its Impact on Mil/Aero Applications
GE Intelligent Platforms High Performance Embedded Computing takes advantage of the technologies and architectures widely deployed in commercial High Performance Computing environments, bringing to the embedded mil/aero world the advantage of their cost-effectiveness, proven performance and extensive support infrastructure and adding the ruggedness that enables them to be deployed in the most challenging situations. As sensor-derived data increases in volume, complexity and criticality, GE Intelligent Platforms HPEC platforms and subsystems from GE are helping mil/aero customers to solve some of todays most demanding problems.
-
How to Use Rohde & Schwarz Instruments in MATLAB(r)
This application note presents methods for integrating Rohde and Schwarz test and measurement (T and M) instruments into The MathWorks MATLAB(r) applications. This allows you to remote-control Rohde and Schwarz instruments for T and M applications from MATLAB(r).
-
Oscilloscope Fundamentals Primer
An oscilloscope is a very versatile instrument used in a broad array of engineering environments.
-
2013 EMF Survey of Embedded Developers
The intent of this paper is to share with embedded developers and vendors the results of the 2013 EMF survey that we recently concluded.
-
Enabling Workload Consolidation on the Next-Generation Communications Platform from Intel(r), codename Crystal Forest
Introducing a new approach which enables a single blade type to perform both control and packet processing functions at very high speed. This white paper describes the key elements of the next-generation communications platform from Intel(r), codename Crystal Forest, which enables a new homogeneous topology, and the key requirements for an effective system-level implementation of the new Intel(r) microarchitecture.
-
Implementation of Real-Time Spectrum Analysis
Measuring signals in real time means: do not lose any signal. But how can we get rid of the blind times?
-
COTS Enabled Rapid Development Deployment
In Military, Aerospace and First Responder applications, System Integrators targeting highly rugged applications often utilize conduction cooled modules because of their superior performance in harsh environments.
-
GPUDirect RDMA
GPUDirect support for RDMA provides low latency interconnectivity between NVIDIA GPUs and various networking, storage, & FPGA devices. This white paper will include how CUDA 5 technology increases GPU autonomy and promotes multi-GPU topologies with high GPU-to-CPU ratios. In addition to improved bandwidth and latency, the resulting increase in GFLOPS/watt poses a significant impact to both HPC & embedded applications. We will dig into scalable PCIe switch hierarchies, as well as software infrastructure to manage device interoperability & GPUDirect streaming.
-
Designing with FPGAs for Speed and Flexibility
The external world has a wide mix of I/O interfaces. Any FPGA module to be used must meet that interface.
Staff, Symmetricom Inc.
Staff, Virtium Technology
Staff, Microsemi
Staff, Kontron
Rodger Hosking, Pentek, Inc.
Staff, Rohde and Schwarz
